FOPLP也正凭借规模化优势快速崛起，被视为CoWoS的潜在继任者。FOWLP基于圆形晶圆进行封装，由于晶圆形状为圆盘状，边缘区域难以充分利用，导致芯片放置面积较小。尺寸与利用率优势是FOPLP的核心竞争力。FOPLP采用方形大尺寸面板作为载板，而非8英寸或12英寸晶圆。
"If we hadn't had the co-CEO model, we probably would have felt that we needed to find a new CEO, or even sell the business, which are things that happen to so many female-run businesses because they don't see how it's going to work. Our experience was that this can really work."
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